BGA repair part chip servicng from China manufacturer - Shenzhen City Xin XunWei Technology Co. Ltd.

Payment Terms:	T/T
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Model No.: CF300

Production Capacity: 20 sets per days

Delivery Date: 10 days

Means of Transport: Ocean,Land

Packing: packed by paper box

Driving Mode: Driving By Stepping Motor

1.Mini type, light weight
2.PC410 instrument
3.3 heating areas
4.Driving by stepping motor
5.Brand new control panel

CF300 Working Parameter:

Model	Chinafix CF300
Solder Type	Leaded Solder/Lead Free
SMD type	Micro BGA,BGA,CSP,QFP
PCB Thickness	0.5mm~4mm
PCB Size	80mm×80mm 415mm×325mm
Heating Mode /Power (Upper)	Hot-blast air /650W
Heating Mode/Power(Bottom)	Hot-blast air /650W
Preheating Mode/ Power	IR/ 700W
PCB Location Mode	Shape or Tongs
Driving Mode	Driving By Stepping Motor
Control Mode	Temperature Control Instrument
Temperature Range	Room temperature ~400°C
Main Power	2000W
Supply Voltage	110V/220V
Machine Dimension	530mm(L)385mm(W)500mm(H)
Machine Weight	18KG

Machine Characteristic
1. Hot air parts adopt exported ceramics heating chips which heats uniformly and

wears well.
2. The support design of three heating area,fine turning to support, in case of

welding area to sink
3. Upper & bottom hot air control temperature independently, it can store 10 groups

and 16 stages temperature curve.
4. Three temperature zones can be controlled independently to achieve reballing and

drying etc function
5. The third temperature zone adopts black infrared heating tube + exported

temperature switch control, heating fastly, temperature-control accurately.
6. Machine part adopts high oxidation treatment, main machine chassis adopts

thicken material in case of machine modification.
7. Upper heating adopts non-labour stepping motor driver, it can be fine adjusted

to relative position exactly.